Product Overview

• This product allows the connection of HP Series 700 workstations to HIPPI-based networks, which typically include Supercomputers (such as Convex or Cray machines) and high speed/capacity peripherals.
• HIPPI 800 Mb/s support.
• Parallel HIPPI.
• Single board design integrating Source and Destination ports.
• Protocols supported:
• - Internet protocol suite
• - custom (Low Level API)
• HP-UX release 9.03 driver.
• Support of IP routing between HIPPI and available LAN/WAN interfaces (such as Ethernet, FDD, Token-Ring, Fibre-Channel, ATM, X25, ISDN).

Performance

Throughput IN: TCP/IP stack - 25 MBytes/s, Low Level API - 28 MBytes/s.

Throughput OUT: TCP/IP stack - 39 MBytes/s, Low Level API - 54 MBytes/s.

Latency (one way): TCP/IP stack - 150 µs, Low Level API - 80 µs.

Major Benefits:

• Total RFX 1374 compliance:
  full LAN emulation capability through the implantation of an ARP agent.
• Graphics bus (SGC) interface:
  this high performance bus gives industry-leading performance.
• Full Series 700 integration.

Physical Characteristics

Size: 28.4 x 21 cm.

Operating temperature rnge: 0 to 55 degrees Celsius.

Operating humidity range: 5% to 95% RH.

Electromagnetic and safety: meets international Class A requirements.

Information from the H.P. specification sheet printed 11/93 Hewlett Packard Grenoble France

Arie van Praag CERN (arie@vxcern.cern.ch) 24 October, 1994